- SpaceX (Bastrop, TX)
- Principal IC Packaging Test Engineer, Silicon Technology (Starlink) at SpaceX Bastrop, TX SpaceX was founded under the belief that a future where ... make this possible, with the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING TEST ENGINEER, SILICON TECHNOLOGY (STARLINK) SpaceX is… more
- SpaceX (Bastrop, TX)
- Principal IC Packaging Engineer,...reliable internet to 4M+ users worldwide. We design, build, test , and operate all parts of the system - ... the ultimate goal of enabling human life on Mars. PRINCIPAL IC PACKAGING ENGINEER, SILICON...SMT assembly experience + OSAT (outsource semiconductor assembly and test ) experience a plus COMPENSATION AND BENEFITS: Pay Range:… more
- Cirtec Medical (Chandler, AZ)
- Principal IC Design Engineer Department: Engineering Location:...+ Act as a Subject Matter Expert (SME) in IC design circuits and principles + Test bench ... to bring medical devices to the market quickly, predictably, and cost-effectively. The Principal Engineer, Integrated Circuit ( IC ) Design is based out of our… more
- RTX Corporation (Raleigh, NC)
- …problems that create a safer, more secure world. An exciting opportunity exists for a Principal Mixed Signal IC Design Engineer to join our strong team. In this ... teams including chip architecture, specification, design, verification, validation, fabrication, packaging , debugging, test development, failure analysis, and… more
- RTX Corporation (Goleta, CA)
- …teams, including chip architecture, specification, design, verification, validation, fabrication, packaging , debugging, test development, failure analysis, and ... documentation. You will work to develop new digital block level microarchitectures, plan work breakdown structures and tasking, design digital logic blocks using Verilog and SystemVerilog HDL and utilize in-house digital IPs to extend functionality and/or to… more
- Skyworks (Austin, TX)
- Principal Packaging Engineer Apply now " Date:Oct 30, 2024 Location: Austin, TX, US Company: Skyworks If you are looking for a challenging and exciting career in ... solder attach, die attach, wire-bonding, over-molding, materials curing, BGA, etc. * Experience in IC packaging as defined in JEDEC, IATF and AEC standards. *… more
- Microsoft Corporation (Sunnyvale, CA)
- …will manage and optimize the Cloud infrastructure. We are looking for a ** ** ** Principal Product & Test Engineer** to work in the dynamic Microsoft Silicon ... phase in partnership with platform teams. + Drive Automated Test Equipment (ATE) test program implementation to...someone with experience in semiconductor IC development, IC manufacturing, fabrication, testing, and packaging . +… more
- Northrop Grumman (Linthicum, MD)
- …failure analysis, the NGMC is a leader in designing, fabricating, packaging , and delivering discriminating microelectronics to the military, aerospace, and ... and large-scale high-performance computing systems. MDA is seeking a ** Principal / Senior Principal RF MMIC Design...chip-level integration. + Proficiency with Cadence Virtuoso or similar IC design software. + Working knowledge of the … more
- Northrop Grumman (Linthicum, MD)
- …Digital hardware designs + Collaborating with peer functions such as Mechanical, Manufacturing, Test , and IC design Engineers + Deriving and trading requirements ... MD. This position will be filled at either the Principal RF Engineer or Sr. Principal RF...requirements, and schematic drawings + Hands on experience utilizing test instrumentation such and power supplies, network analyzers, Oscilloscopes,… more
- Northrop Grumman (Mcclellan, CA)
- …and digital hardware designs + Collaborate with peer functions in Mechanical, Manufacturing, Test , and IC design engineering + Derive and trade requirements with ... assembly-level requirements This position may be filled as a Principal RF Modeling and Simulation Engineer OR Sr. ...versed in working with Ansys HFSS modeling for RF packaging effects. + Experience with spectrum and network analyzer… more