- Raytheon (Tucson, AZ)
- …meaningful problems that create a safer, more secure world. The Product Design and Packaging (PDP) Team at Raytheon is seeking a Senior Electrical Engineer to ... join our team as an Electrical Computer Aided Designer Engineer (ECAD). Our Mission is to develop best in industry technologies that align product capabilities to… more
- Raytheon (Tucson, AZ)
- …more secure world. The RF Mechanical Team at Raytheon is seeking a talented Senior Engineer to join our team in Tucson, AZ. The candidate will be responsible for ... providing innovative design solutions for the packaging of antennas, RF Circuit Card Assemblies, radomes, and...of 5 years of prior relevant experience, or an Advanced Degree in a related field and minimum 3… more
- Raytheon (Tucson, AZ)
- …US RTX Corporation is an Aerospace and Defense company that provides advanced systems and services for commercial, military and government customers worldwide. It ... BBN team: Job Summary: The Mechanical Products Directorate is searching for an engineer with experience in Harness and Interconnect design to work in Tucson,… more
- Micron Technology, Inc. (Boise, ID)
- …the world to learn, communicate and advance faster than ever. **Equipment Development Engineer - Advanced Packaging Technology Development** As an Equipment ... Development Engineer in Micron's Advanced Technology Packaging Development (APTD) team, you...interactions. Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related… more
- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. Micron's Advanced Packaging Technology Development group is seeking a Member of Technical ... Staff or Principal Process Development Engineer to join a growing...Process Engineering for Far Back End Interconnects, Semiconductor Packaging , Semiconductor Assembly, Interposers and or SoC integration or… more
- Micron Technology, Inc. (Boise, ID)
- …advance faster than ever. Responsibilities will include: * Develop, diagnose and resolve packaging process related problems for Die and Wafer bonding related ... projects * Coordinate and execute process , equipment and material evaluation / optimization initiatives and...degree + 5(+) years of industry experience specific to Advanced Packaging and wafer-to-wafer bonding. As a… more
- Micron Technology, Inc. (Boise, ID)
- …to join our Wafer Level Packaging Technologies Team in Boise, Idaho. As an Advanced Package TD Process Integration Engineer at Micron, you will define ... across domains **Qualifications and Skills** + At least 5 years experience in advanced packaging industry + Degree/Major: MS or Ph.D. in Electrical, Computer… more
- L3Harris (Palm Bay, FL)
- Job Title: Technologist, 3D Semiconductor Integration and Advanced Packaging Engineer Job Code: 16213 Job Location: Palm Bay, FL Job Schedule: 9/80 (Every ... IP technology transfers. + Lead intra and inter technology transfer for advanced packaging including process documentation (ie PDKs, tool lists, process… more
- Micron Technology, Inc. (Boise, ID)
- …communicate and advance faster than ever. As an **Sr./Principal Equipment Development Engineer ** in Micron's Advanced Technology Packaging Development (APTD) ... interactions. Experience in wafer bonding, plating, warpage control and packaging process development and understanding of related inline/electrical/probe… more
- Micron Technology, Inc. (Boise, ID)
- …inspiring the world to learn, communicate and advance faster than ever. As a Process Engineer you will be primarily responsible for starting up, developing and ... optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management… more
