- Global Foundries (Malta, NY)
- …to network with executives. Summary of Role: Intern engineering student to contribute to 3D Advanced Heterogeneous Integration Development which includes ... verbal communication skills + Strong planning & organizational skills + Any Advanced Semiconductor Packaging or Semiconductor Integration experience a big plus… more
- Global Foundries (Malta, NY)
- …which give our new team members life-long connections and skills. Summary of Role: 3D Advanced Heterogeneous Integration Development Engineer which ... the tools & materials for the Malta Fab 8 Advanced Semiconductor fab and Fishkill PDL (Packaging Differentiation Line)....develop new wafer level and die level 2.5D and 3D Heterogeneous Integration processes. +… more
- L3Harris (Palm Bay, FL)
- …Description: Responsible for architecting 3D semiconductor packaging solutions and heterogeneous integration processes. Work across the industry to identify ... Job Title: Technologist, 3D Semiconductor Integration and Advanced...Essential Functions: + Technical team leadership focused on developing 3D heterogeneous packaging solutions such as fine… more
- Meta (Sunnyvale, CA)
- …Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/ 3D and heterogeneous integration to improve bandwidth, power ... Silicon Packaging Design Engineer Responsibilities: 1. Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer… more
- Micron Technology, Inc. (Folsom, CA)
- …Micron Technology, Inc. has redefined innovation with the world's most advanced memory and semiconductor technologies. We're an international team of visionaries ... domain experts across platforms, systems architecture, component design, and advanced packaging, you'll analyze platform architecture trade-offs in close… more
- GE Vernova (Wilmington, NC)
- …data requirements and relationships between data elements. + Design and develop advanced data structures that optimize data storage, retrieval, and processing for ... database designs to solve challenging data modeling and data integration problems, including designs applying ontology, designs leveraging relational, graphical,… more
- Micross Components (Research Triangle Park, NC)
- …is seeking an experienced Sales person to help grow its Wafer Level Packaging and 3D Heterogeneous Integration (3DHI) product lines at its Research Triangle ... Park, NC facility. This position will serve primarily as an outward facing Sales person identifying and developing opportunities with existing and potential clients in support of the Inside Sales/Business Development Team and with assistance from the Micross… more